Printed Electronics Europe: Growth Sectors for Conductive Inks as They Solve More Problems

PR82885

BERLIN, Feb. 14, 2020 /PRNewswire=KYODO JBN/ --

In 2020, the market for conductive inks will be $2.4Bn, according to extensive

research by IDTechEx (http://www.idtechex.com/ink). Of that, 95% of the

conductive ink supply by value goes into just three applications – the printed

bus bars and fingers on PV solar cells, exterior automotive heating

applications (defoggers) and touch screen edge electrodes.

However, for years now there has been work on a myriad of new applications for

conductive ink which are beginning to come to commercial fruition. These market

opportunities will be in the spotlight at Printed Electronics Europe 2020, held

in Berlin on 13-14 May 2020, with over 2,500 attendees and over 250 speakers

covering the broad range of opportunities. Many exhibit compound annual growth

rates (CAGR) of several hundred percent through to 2025.

In this article Raghu Das, CEO of IDTechEx assesses some of those opportunities.

Material Opportunities for 5G

The opportunity: By 2025 the value of 5G connections globally will be worth

$303 Billion.

The problem: For highest speed data transfer 5G systems will use higher

frequencies such as 28Ghz and 39Ghz, significantly higher than the 0.7Ghz –

2.5Ghz frequencies typically used in a cellphone. This results in more

potential for electromagnetic interference (EMI) between componentry, so they

need to be adequately 'shielded'. Another key trend here is the rise of

multi-chip packages in which connectivity as well as other dies sit inside a

single package. In such cases, even internal EMI shielding and

compartmentalization might be required.

The printed electronics solution: Spray-on, coat-on or print-on solutions are

in now in testing and early production, which offer uniform coverage of

components at higher manufacturing speed and potentially at lower cost.

Printed Electronics Europe 2020 features a session on material opportunities

for 5G, including EMI shielding advances.

Material Opportunities for Power Semiconductors in Electric Vehicles

The opportunity: In 2025 126 tonnes of die attach material will be needed for

electric vehicles.

The problem: The electric vehicle market is expanding. As a consequence, the

market for power modules within all manners of electric vehicles is growing,

using semiconductor technologies such as SiC and GaN. The trend is towards

higher power densities which translates to higher operational temperatures,

from 170 Degrees Celsius towards 250 Degrees Celsius. The materials around the

power packages need to cope with these higher temperatures.

The printed electronics solution: Silver offers high conductivity and a high

melting point versus conventional semiconductor attachment materials.

Nanoparticle silver is already being used by some EV makers as part of the die

attach system.

Printed Electronics Europe 2020 features sessions on die attach materials and

materials for heat management within electric vehicles.

Printed Heaters in Autonomous and/or Electric Vehicles

The opportunity: In 2025 148 million electric vehicles will be sold, across

land, water and air electric vehicles types.

The problems: Cold temperatures impact batteries by increasing their internal

resistance and lowering their capacity. For those living in very cold climates,

electric vehicle batteries may therefore need assisted heating. LIDAR systems,

used to enable autonomy, require clear optical pathways, so any ice or snow on

the LIDAR optics needs to be melted away through a heating system.

Additionally, without an internal combustion engine, electric vehicles require

other ways to produce heat for the occupants.

The printed electronics solution: Printed heaters are lightweight, offer

relative ease with custom designs and shapes and are typically flexible for

easy integration and application of heat where it is needed.

Printed Electronics Europe 2020 features presentations and exhibitors covering

these aspects including transparent heaters and flexible heaters.

3D Electronics to Improve Human Machines Interfaces

The opportunity: The market for 3D printed electronics and Circuit prototyping

will be worth over $1 Bn by 2025.

The problem: Combining circuit substrates, switches, LEDs and other components

and then fitting these to control panels involves a relatively high numbers of

components and tooling set up time. Often the final product is not weight

efficient and nor is it most cost effective for small batch numbers.

The printed electronics solution: Printing the wiring, switches and other

components and then molding this as the final structure can overcome the above

limitations. The final pieces can be lighter weight. It can be easier to change

or customize designs. Differentiation can be provided by having interactive 3D

surfaces rather than 2D ones.

Printed Electronics Europe 2020 features presentations and exhibitors covering

In Mold Electronics, film inserted electronics and 3D printed electronics.

These are just four of the opportunities that will be covered, in addition to

others including antennas, sensors, e-textiles, electronic skin patches and

more. See the evolving speaker list at www.PrintedElectronicsEurope.com and

book by 20 February 2020 for the 30% attendee discount.

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Media Contact:

Jessica Abineri

Marketing Coordinator   

press@IDTechEx.com   

+44(0)1223 812300

Source:  IDTechEx