PR91089

FREMONT, Calif., Aug. 10, 2021 /PRNewswire=KYODO JBN/--

YES (Yield Engineering Systems, Inc.) ( https://yieldengineering.com/ ), a

leading manufacturer of process equipment for semiconductor advanced packaging,

life sciences and "More-than-Moore" applications, today announced its first

shipment of the VertaCure(TM) XP vacuum curing system to a China-based OSAT

customer. The system will support high volume manufacturing of flip chip and

wafer-level packaging (WLP) applications. Multiple repeat orders are expected

from this customer for delivery in 2022.

During the evaluation process, the OSAT was able to validate the VertaCure XP's

technical superiority over competing options – 5x less outgassing, 25-30%

process time reduction and significant CoO (cost of ownership) improvement –

for a variety of polyimides including the Hitachi Dupont HD-4100 series, Asahi

BM-300 and BL-301, Fujifilm, and more. In addition, the VertaCure XP's vacuum

technology provided excellent particle performance and allowed for a wider

range of processes with which to create new applications.

"OSATs are increasingly critical to the supply chain as advanced packaging

technology requirements evolve," explained Alex Chow, Asia Sales President &

General Manager at YES. "This major win further confirms YES's ability to

support OSATs globally with the operational flexibility, technology leadership

and high economic value that they require. We look forward to helping these key

customers create innovative solutions for the vibrant semiconductor market."

"Advanced packaging is a fundamental building block for innovation in the

semiconductor industry. YES's leadership position is based on providing

superior on-wafer results coupled with low cost-of-ownership. This order

solidifies YES's growing role as a trusted global partner in the production of

leading-edge technologies," said Rezwan Lateef, President of YES.

About YES

YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech,

cost-effective equipment for transforming surfaces, materials and interfaces.  

The company's product lines include vacuum cure ovens, chemical vapor

deposition (CVD) systems, and plasma etching tools used for precise surface

modification and thin-film coating of semiconductor wafers, semiconductor and

MEMS devices, and biodevices. With YES, customers ranging from startups to

Fortune 100 companies can create and volume-produce products in a wide range of

markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality

and Life Sciences. YES is headquartered in Fremont, California, with a growing

global presence. For more information, please visit: www.yieldengineering.com.

Media Contact

Victoria Barnes

Director of Communications

YES (Yield Engineering Systems, Inc.)

+1-510-954-6723 direct

VBarnes@yieldengineering.com

Source: Yield Engineering Systems, Inc.