EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits
PR94785
ST. FLORIAN, Austria and JERUSALEM, Mar. 2 /PRNewswire=KYODO JBN/ --
- Breakthrough wafer-level optics technologies help solve a key challenge of
connecting many fibers to silicon chips for datacom and telecom applications
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment
for the MEMS, nanotechnology and semiconductor markets, and Teramount, the
leader in scalable solutions for connecting optical fibers to silicon chips,
announce a collaboration on implementing wafer-level optics to solve a major
obstacle of silicon photonics, namely fiber chip packaging. The collaboration
will leverage EVG's nanoimprint lithography (NIL) technology, expertise and
services with Teramount's PhotonicPlug technology.
Under this collaboration, standard CMOS wafers that implement silicon photonics
chips will be post processed using EVG’s NIL technology to implement optical
elements such as mirrors and lenses for Teramount's unique "self-aligning
optics". This enables flexible beam extraction from the chips and easy
connection to a large number of optical fibers. Furthermore, it enables
wafer-level optical inspection capabilities for enhancing silicon photonics
wafer manufacturing.
The collaboration is being carried out within EVG’s NILPhotonics (R) Competence
Center at its headquarters in St. Florian, Austria. The NILPhotonics Competence
Center provides an open access innovation incubator for customers and partners
across the NIL supply chain to collaborate to shorten development cycles and
time to market for innovative photonic devices and applications. Through the
collaboration with Teramount, EVG provides process development and production
services, as well as expertise in both CMOS and photonics manufacturing, thus
accelerating the commercialization of Teramount's PhotonicPlug technology.
The need for high-speed data transfers in data centers, telecom networks,
sensors and emerging applications in advanced computing for artificial
intelligence (AI) is growing exponentially. This in turn is driving the
importance of developing solutions that can cost-effectively scale up
production of silicon photonics, which enable ultra-high bandwidth performance.
The collaboration between EVG and Teramount aims to solve this problem.
“Our joint work with EVG has been very successful in producing this innovative
synergy between wafer-level optics and silicon photonics wafer manufacturing,”
said Hesham Taha, CEO of Teramount. “By offering this capability to the
industry, Teramount solves one of the major hurdles to further adoption of
optical connectivity, which is critical for so many applications that require
high-speed data transfers and low power consumption.”
“Teramount’s PhotonicPlug silicon photonics packaging technology is a truly
novel approach to improving optical performance, and we are excited to be a
partner in helping to bring it to the market,” stated Markus Wimplinger,
Corporate Technology Development and IP Director at EV Group. “This is just the
latest example of innovative technology developed with the support of EVG’s
process and equipment know-how through our NILPhotonics Competence Center,
where we help our partners and customers turn new ideas into innovative
products.”
About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the
manufacture of semiconductors, microelectromechanical systems (MEMS), compound
semiconductors, power devices and nanotechnology devices. Key products include
wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL)
and metrology equipment, as well as photoresist coaters, cleaners and
inspection systems. Founded in 1980, EV Group services and supports an
elaborate network of global customers and partners all over the world. More
information about EVG is available at www.EVGroup.com.
About Teramount
Teramount changes the world of optical connectivity by offering a novel
solution for connecting optics to silicon for data center, advanced computing,
sensors and other datacom and telecom applications. Its innovative PhotonicPlug
solution provides a scalable connectivity of fibers to photonic chips and
aligns photonics with standard semiconductor high-volume manufacturing and
packaging capabilities. Teramount’s office is located in Jerusalem, Israel. For
more information, visit www.teramount.com.
EV Group Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
David Moreno
Principal
Open Sky Communications
Tel: +1.415.519.3915
E-mail: dmoreno@openskypr.com
Teramount Contact:
Hesham Taha
Chief Executive Officer
Teramount Ltd.
Tel: +972 50 641 9792
E-mail: hesham.taha@teramount.com
Photo - https://mma.prnewswire.com/media/1757193/NanoImprint.jpg
Photo - https://mma.prnewswire.com/media/1757194/Teramount_PhotonicPlug.jpg
Joint source: Teramount and EV Group
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