ERS electronic unveils the Next-Generation of its ADM330 with a new design and advanced features
PR95236
MUNICH, Germany, March 30, 2022 /PRNewswire=KYODO JBN/ --
ERS electronic [https://www.ers-gmbh.com/], the industry leader in the
market of thermal management solutions for semiconductor manufacturing, reveals
the details of its third-generation flagship thermal debond machine, ADM330
[https://www.ers-gmbh.com/fan-out-equipment/thermal-debonding/adm]. The machine
was introduced to the market in 2007 as the first-of-its-kind. Since then, it
has become an industry-favourite and can be found on the production floors of
most semiconductor manufacturers and OSATs involved in Advanced Packaging
worldwide.
Earlier this month, the company was recognized for its continuous
innovation and contribution to heterogeneous integration technologies with a 3D
InCites "Equipment Supplier of the Year" award.
ERS is now giving a first look at the next-generation ADM330, which has
changed its previously matte metallic appearance to a clean, white surface
matching most equipment found in a cleanroom. In addition, the machine is now
fully compliant with the GEM300 SEMI standards, thus allowing seamless
integration into automated fabs and Industry 4.0 architectures. Warpage
adjustment performance has also been improved thanks to a unique thermal chuck
design that enables a strong vacuum performance three times better than its
predecessor. Lastly, the new ADM330 offers an implemented add-on software
feature allowing stand-alone laser marking for improved wafer traceability.
"We are very excited to reveal the latest upgrade of our flagship machine.
With these improvements, we continue to deliver a robust system that meets the
ever-changing process requirements of Advanced Packaging," says Debbie-Claire
Sanchez, FO Equipment Business Unit manager at ERS electronic.
"Fan-out packaging market value is expected to reach more than US$3.4
billion by 2026 at a 14% CAGR 1, mainly driven by 5G, HPC and IoT
applications2", announces Gabriela Pereira, Technology & Market Analyst,
Semiconductor, Memory & Computing at Yole Développement (Yole).
[http://www.yole.fr/] "In this dynamic context, one of the main technical
challenges is the warpage of the reconstituted wafers due to CTE mismatch
between the different materials applied. Next-generation of ERS ADM330
debonding equipment announced today by ERS electronic will be a solution to
enable warpage adjustment improvement and contribute to reducing yield losses."
1 Between 2021 and 2026
2 Source: Advanced Packaging Quarterly Market Monitor
[https://www.i-micronews.com/products/advanced-packaging-quarterly-market-monitor/],
Q4 2021, Yole Développement (Yole)
About ERS:
ERS electronic GmbH has gained an outstanding reputation in the
semiconductor industry with its fast and accurate air cool-based thermal chuck
systems for wafer probing and its thermal debonding and warpage adjustment
tools for FOWLP/PLP.
www.ers-gmbh.com
Logo: https://mma.prnewswire.com/media/1776594/ERS_Logo.jpg
Photo: https://mma.prnewswire.com/media/1776593/ADM330_Gen3.jpg
Source: ERS electronic GmbH
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