Axcelis Announces Follow On Shipments of Purion Power Series Implanters to Power Device Chipmaker in Japan
PR95271
BEVERLY, Mass., March 31, 2022 /PRNewswire=KYODO JBN/ --
Purion Power Series Features 300mm Thin Wafer Handling Capability
Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion
implantation solutions for the semiconductor industry, today announced follow
on shipments of the Company's Purion XE(TM) high energy and Purion M(TM) medium
current Power Series(TM) implanters to a leading power device chipmaker located
in Japan. The systems will be used in high volume production of 300mm thin
silicon wafer based MOSFET and IGBT devices for automotive and other power
management applications.
Executive Vice President of Product Development, Bill Bintz, commented, "The
unique capabilities of the Purion Power Series, combined with the
implant-intensive nature of the power device segment, uniquely positions
Axcelis to benefit from growth in this market. These tools incorporate features
and process control capabilities, including the platform's thin wafer handling
capability, that are enabling for the power device market. We look forward to
expanding the Purion platform footprint in Japan and supporting our customers'
goals to increase their manufacturing capacity."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing
innovative, high-productivity solutions for the semiconductor industry for over
40 years. Axcelis is dedicated to developing enabling process applications
through the design, manufacture and complete life cycle support (
) of ion implantation (
) systems, one of the most critical and enabling steps in the IC manufacturing
process. Learn more about Axcelis at www.axcelis.com .
CONTACTS:
Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552
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SOURCE Axcelis Technologies, Inc.
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