PR85050

SHANGHAI, Aug. 7, 2020 /PRNewswire=KYODO JBN/--

- Small Size Connects the Great 5G Era

At the 14th IOTE, SIMCom launched an ultra-small 5G module SIM8202G-M2 with the

new 4-antenna design, to support the sustainable development of the industry.

https://cdn5.prnasia.com/202008/SIMCom/video.mp4 

SIM8202G-M2 (https://www.simcom.com/product/SIM8202GM2.html) is a small-size

multi-band 5G module, which supports NSA/SA networking and covers all frequency

bands of major network carriers around the world. It adopts the standard M2

interface and its AT command set is compatible with SIM7912G / SIM8200X-M2

modules, which can minimize the investment cost and speed up the market launch

for customers. Compared with other 5G modules, it is greatly improved in the

following aspects.

1. New 4-antenna design

SIM8202G-M2 adopts a new 4-antenna design, which effectively increases

communication capacity, sends and receives data in an active manner, and

maintains high data speed and stability.

2. Ultra-small size

The size of SIM8202G-M2 is only 30*42mm. The reduction in size brings great

challenges to technology and process design. The increase in internal

components leads to a denser component layout, causing limited power line

routing width, harder isolation and protection of the high-rate signal line,

RF-sensitive line, clock signal and harder controlled impedance routing.

Therefore, SIMCom repeatedly optimized the design and deleted redundant design.

Components with smaller package dimensions, higher performance and more

reliable quality are adopted to effectively meet the

multi-band/high-performance/high-bandwidth/multi-system requirements of 5G

modules.

3. Large exposed copper area facilitates heat dissipation

The transmission rate of 5G modules is greatly increased. The increases in

power consumption by CPU, RF transceiver and RF PA all generate more heat in

modules. To ensure the module can work stably for a long time, the design of

SIM8202G-M2 takes full account of the layout of heating components, making sure

the main heating components have sufficient holes to base. At the same time, a

large exposed copper area is designed on the back of the module to facilitate

the heat dissipation of the module by silica gel.

SIM8202G-M2 features high-speed transmission and low latency. It can be widely

used in terminals for VR, AR, CPE, IoV, IIoT and 4K/8K HD video.

About SIMCom (https://www.simcom.com/ )

SIMCom Wireless Solutions Limited is a global leader in the cellular module

space and fully committed to provide 2G/3G, LPWA, 4G, Smart Modules, C-V2X, 5G

modules around the world.

For more information, visit: www.simcom.com,

LinkedIn:https://www.linkedin.com/company/663127/admin/

Twitter:https://twitter.com/simcom_m2m

Facebook:https://www.facebook.com/simcomm2m .

SOURCE: SIMCom