PR94785

ST. FLORIAN, Austria and JERUSALEM, Mar. 2 /PRNewswire=KYODO JBN/ --

- Breakthrough wafer-level optics technologies help solve a key challenge of

connecting many fibers to silicon chips for datacom and telecom applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment

for the MEMS, nanotechnology and semiconductor markets, and Teramount, the

leader in scalable solutions for connecting optical fibers to silicon chips,

announce a collaboration on implementing wafer-level optics to solve a major

obstacle of silicon photonics, namely fiber chip packaging. The collaboration

will leverage EVG's nanoimprint lithography (NIL) technology, expertise and

services with Teramount's PhotonicPlug technology.

Under this collaboration, standard CMOS wafers that implement silicon photonics

chips will be post processed using EVG’s NIL technology to implement optical

elements such as mirrors and lenses for Teramount's unique "self-aligning

optics". This enables flexible beam extraction from the chips and easy

connection to a large number of optical fibers. Furthermore, it enables

wafer-level optical inspection capabilities for enhancing silicon photonics

wafer manufacturing.

The collaboration is being carried out within EVG’s NILPhotonics (R) Competence

Center at its headquarters in St. Florian, Austria. The NILPhotonics Competence

Center provides an open access innovation incubator for customers and partners

across the NIL supply chain to collaborate to shorten development cycles and

time to market for innovative photonic devices and applications. Through the

collaboration with Teramount, EVG provides process development and production

services, as well as expertise in both CMOS and photonics manufacturing, thus

accelerating the commercialization of Teramount's PhotonicPlug technology.

The need for high-speed data transfers in data centers, telecom networks,

sensors and emerging applications in advanced computing for artificial

intelligence (AI) is growing exponentially. This in turn is driving the

importance of developing solutions that can cost-effectively scale up

production of silicon photonics, which enable ultra-high bandwidth performance.

The collaboration between EVG and Teramount aims to solve this problem.

“Our joint work with EVG has been very successful in producing this innovative

synergy between wafer-level optics and silicon photonics wafer manufacturing,”

said Hesham Taha, CEO of Teramount. “By offering this capability to the

industry, Teramount solves one of the major hurdles to further adoption of

optical connectivity, which is critical for so many applications that require

high-speed data transfers and low power consumption.”

“Teramount’s PhotonicPlug silicon photonics packaging technology is a truly

novel approach to improving optical performance, and we are excited to be a

partner in helping to bring it to the market,” stated Markus Wimplinger,

Corporate Technology Development and IP Director at EV Group. “This is just the

latest example of innovative technology developed with the support of EVG’s

process and equipment know-how through our NILPhotonics Competence Center,

where we help our partners and customers turn new ideas into innovative

products.”

About EV Group (EVG)

EV Group (EVG) is a leading supplier of equipment and process solutions for the

manufacture of semiconductors, microelectromechanical systems (MEMS), compound

semiconductors, power devices and nanotechnology devices. Key products include

wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL)

and metrology equipment, as well as photoresist coaters, cleaners and

inspection systems. Founded in 1980, EV Group services and supports an

elaborate network of global customers and partners all over the world. More

information about EVG is available at www.EVGroup.com.

About Teramount

Teramount changes the world of optical connectivity by offering a novel

solution for connecting optics to silicon for data center, advanced computing,

sensors and other datacom and telecom applications. Its innovative PhotonicPlug

solution provides a scalable connectivity of fibers to photonic chips and

aligns photonics with standard semiconductor high-volume manufacturing and

packaging capabilities. Teramount’s office is located in Jerusalem, Israel. For

more information, visit www.teramount.com.

EV Group Contacts:

Clemens Schütte

Director, Marketing and Communications

EV Group

Tel: +43 7712 5311 0

E-mail: Marketing@EVGroup.com  

David Moreno

Principal

Open Sky Communications

Tel: +1.415.519.3915

E-mail: dmoreno@openskypr.com  

Teramount Contact:

Hesham Taha

Chief Executive Officer

Teramount Ltd.

Tel: +972 50 641 9792

E-mail: hesham.taha@teramount.com  

Photo - https://mma.prnewswire.com/media/1757193/NanoImprint.jpg  

Photo - https://mma.prnewswire.com/media/1757194/Teramount_PhotonicPlug.jpg

Joint source: Teramount and EV Group