PR95236

MUNICH, Germany, March 30, 2022 /PRNewswire=KYODO JBN/ --

    ERS electronic [https://www.ers-gmbh.com/], the industry leader in the

market of thermal management solutions for semiconductor manufacturing, reveals

the details of its third-generation flagship thermal debond machine, ADM330

[https://www.ers-gmbh.com/fan-out-equipment/thermal-debonding/adm]. The machine

was introduced to the market in 2007 as the first-of-its-kind. Since then, it

has become an industry-favourite and can be found on the production floors of

most semiconductor manufacturers and OSATs involved in Advanced Packaging

worldwide.

    Earlier this month, the company was recognized for its continuous

innovation and contribution to heterogeneous integration technologies with a 3D

InCites "Equipment Supplier of the Year" award.

    ERS is now giving a first look at the next-generation ADM330, which has

changed its previously matte metallic appearance to a clean, white surface

matching most equipment found in a cleanroom. In addition, the machine is now

fully compliant with the GEM300 SEMI standards, thus allowing seamless

integration into automated fabs and Industry 4.0 architectures. Warpage

adjustment performance has also been improved thanks to a unique thermal chuck

design that enables a strong vacuum performance three times better than its

predecessor. Lastly, the new ADM330 offers an implemented add-on software

feature allowing stand-alone laser marking for improved wafer traceability.

    "We are very excited to reveal the latest upgrade of our flagship machine.

With these improvements, we continue to deliver a robust system that meets the

ever-changing process requirements of Advanced Packaging," says Debbie-Claire

Sanchez, FO Equipment Business Unit manager at ERS electronic.

    "Fan-out packaging market value is expected to reach more than US$3.4

billion by 2026 at a 14% CAGR 1, mainly driven by 5G, HPC and IoT

applications2", announces Gabriela Pereira, Technology & Market Analyst,

Semiconductor, Memory & Computing at Yole Développement (Yole).

[http://www.yole.fr/] "In this dynamic context, one of the main technical

challenges is the warpage of the reconstituted wafers due to CTE mismatch

between the different materials applied. Next-generation of ERS ADM330

debonding equipment announced today by ERS electronic will be a solution to

enable warpage adjustment improvement and contribute to reducing yield losses."

    1 Between 2021 and 2026

    2 Source: Advanced Packaging Quarterly Market Monitor

[https://www.i-micronews.com/products/advanced-packaging-quarterly-market-monitor/],

Q4 2021, Yole Développement (Yole)

    About ERS:

    ERS electronic GmbH has gained an outstanding reputation in the

semiconductor industry with its fast and accurate air cool-based thermal chuck

systems for wafer probing and its thermal debonding and warpage adjustment

tools for FOWLP/PLP.

    www.ers-gmbh.com

    Logo: https://mma.prnewswire.com/media/1776594/ERS_Logo.jpg

    Photo: https://mma.prnewswire.com/media/1776593/ADM330_Gen3.jpg

    Source: ERS electronic GmbH