JCET Net Profit Reached Record High According to 2021 Earnings Pre Announcement

JCET Group

PR94214

 

SHANGHAI, Jan. 24, 2022 /PRNewswire=KYODO JBN/ --

 

Today, JCET Group (SSE: 600584), a leading global provider of integrated

circuit (IC) manufacturing and technology services, announced unaudited

preliminary net profit results for 2021.

 

From January 1, 2021 to December 31, 2021, net profit attributable to

shareholders will be RMB 2.80 billion to RMB 3.08 billion, an increase of RMB

1.496 billion to RMB 1.776 billion and 114.72% to 136.20% as compared with the

same period of the previous year. The net profit attributable to shareholders

excluding non-recurring gains and losses is approximately RMB 2.35 billion to

RMB 2.58 billion, an increase of RMB 1.398 billion to 1.628 billion and 146.85%

to 171.01% as compared with the same period of the previous year. These

preliminary results are estimated based on the company's operating conditions

and has not yet been audited by a certified public accountant.

 

JCET's operational efficiency has improved continuously, driven primarily by a

focus on high value-added business, fast growth market application areas,

integration and upgrade of global resources. The company enhanced synergies

among all subsidiaries for technological development and production capacity

layout. This helped us to better fulfill customer requirements and market

demand. The company also established a systematic high performance management

system for sustainable growth. At the same time, customer demand from both

domestic and international customers remained strong. All manufacturing units

focused continuously on optimizing product portfolio and controlling costs and

operating expenses, which drove higher profitability for the year.

 

About JCET Group

 

JCET Group is the world's leading integrated-circuit manufacturing and

technology services provider, offering a full range of turnkey services that

include semiconductor package integration design and characterization, R&D,

wafer probe, wafer bumping, package assembly, final test and drop shipment to

vendors around the world.

 

Our comprehensive portfolio covers a wide spectrum of semiconductor

applications such as mobile, communication, compute, consumer, automotive and

industry etc., through advanced wafer level packaging, 2.5D/3D,

System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET

Group has two R&D centers in China and Korea, six manufacturing locations in

China, Korea and Singapore, and sales centers around the world, providing close

technology collaboration and efficient supply-chain manufacturing to customers

in China and around the world.

 

SOURCE JCET Group

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