PR98513

SHANGHAI, Oct. 27, 2022 /PRNewswire=KYODO JBN/ --

Q3 2022 Financial Highlights:

- Revenue was RMB 9.18 billion, an increase of 13.4% year-on-year. A record

high third quarter in the company's history.

- Generated RMB 1.70 billion cash from operations. With net capex investments

of RMB 1.07 billion, free cash flow for the quarter was RMB 0.63 billion.

- Net profit was RMB 0.91 billion, a record high third quarter in the company's

history.

- Earnings per share was RMB 0.51, as compared to RMB 0.45 in Q3 2021.

Q3 YTD 2022 Financial Highlights:

- Revenue was RMB 24.78 billion, an increase of 13.1% year-on-year, a record

high in the company's history.

- Generated RMB 4.38 billion cash from operations. With net capex investments

of RMB 2.58 billion, free cash flow for the first three quarters of 2022 was

RMB 1.80 billion.

- Net profit was RMB 2.45 billion, a record high in the company's history.

Earnings per share was RMB 1.38, as compared to RMB 1.23 in Q3 YTD 2021.

Today, JCET Group (SSE: 600584), a leading global provider of integrated

circuit (IC) manufacturing and technology services, announced its financial

results for the third quarter of 2022. The financial report shows that in the

third quarter, JCET achieved revenue of RMB 9.18 billion, an increase of 13.4%

year-on-year, and net profit of RMB 0.91 billion, an increase of 14.6%

year-on-year, a record high third quarter in the company's history.

In recent years, JCET leverages its international and domestic "dual

circulation" model, constantly optimizes the product structure and its business

proportion, flexibly adjusts the order structure and capacity layout, and

enhances its ability to withstand cyclical fluctuations.

JCET accelerated the research and development of high-performance packaging and

testing technologies including 2.5D/3D chiplet integration, and the

introduction of customer products. The company strengthened the development of

high-value added markets such as automotive electronics, computing electronics

and 5G communications, and enhanced value-added services such as high-end

testing and design services. The related revenue and proportion increased

rapidly. Among them, the company's advanced packaging related revenue, which

mainly includes high-density system level packaging technology, large size flip

chip technology and fan-out wafer level packaging technology increased by 21%

year-on-year in the first three quarters. The revenue related to automotive

electronics and computing electronics increased 59% year-on-year in the first

three quarters. At the same time, the company's overseas factories grew

strongly, and through deepening lean production and strengthening cost control,

the company overcame the trend and achieved record high growth in the third

quarter. The company continued to improve the management of working capital,

stably produced abundant cash flow, and laid a solid foundation for sustainable

development in the future.

At the same time, the company makes great efforts in innovation, cooperates

with the industrial supply chain, continuously improves talent incentives,

employee care and other measures, practices corporate social responsibility,

and stimulates the cohesion of all employees. The company launched its first

employee stock ownership plan and stock option incentive plan since its public

listing, reflecting the firm confidence of all its employees in the long-term

development of the company.

Mr. Li Zheng, CEO of JCET said, "In recent years, JCET has successfully

introduced the mass production of high-density high-performance packaging

technology to many of the world's leading IC manufacturers, providing a solid

foundation for the company to expand its market share in advanced technology

and solidify its steady growth. In the first three quarters of this year, the

revenue and profit from JCET's high-density system-level packaging technology

and fan-out wafer level packaging technology increased significantly compared

with the same period last year, reflecting the significant growth in the

large-scale application of semiconductor heterogeneous integrated packaging in

computers, new energy vehicles, smart cars, intelligent manufacturing, and

other fields. JCET will further increase its resource investment in relevant

technologies and markets and is confident to continue strengthening its leading

position in the global high-performance packaging market."

Click to view: JCET 2022 Third Quarter Report

(https://www.jcetglobal.com/uploads/JCET%20Finance%20Report%202022Q3.pdf)

About JCET Group

JCET Group is the world's leading integrated-circuit manufacturing and

technology services provider, offering a full range of turnkey services that

include semiconductor package integration design and characterization, R&D,

wafer probe, wafer bumping, package assembly, final test and drop shipment to

vendors around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor

applications such as mobile, communication, compute, consumer, automotive and

industry etc., through advanced wafer level packaging, 2.5D/3D,

System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET

Group has two R&D centers in China and Korea, six manufacturing locations in

China, Korea and Singapore, and sales centers around the world, providing close

technology collaboration and efficient supply-chain manufacturing to customers

in China and around the world.

Source: JCET Group

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