DFI Empowers Edge AI Deployment with EC70A-TGU Compact Fanless System
PR99067
TAIPEI, Dec. 1, 2022 /PRNewswire=KYODO JBN/ --
DFI(http://www.dfi.com/?ad=media_1129-prnewswire_global&edm=media_1129-prnewswir
e_global), the leading global provider of embedded solutions and Edge AI
computing technology across multiple industries, is releasing the new Edge AI
inference computer
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global).
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) is powered by Intel® 11th Gen Tiger Lake
Core™ processors, with 8GB onboard memory in a compact platform. Equipped with
an all-new GPU in Iris® Xe embedded graphics,
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) delivers disruptive GPU graphics performance
and enables faster processing of images and video streams. Users can leverage
the GPU to power cutting-edge AI solutions for various applications, including
Industrial Automation, AMR/AGV, Smart Transportation, Medical Imaging, etc.
Maintaining the small size of the previous generation fanless embedded system,
the
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) is equipped with a compact fanless design,
measuring only 181.6mm x 57mm x 118.4mm, while providing significantly upgraded
performance. In addition,
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) supports multiple I/Os, outperforming its
counterparts with up to 6 USB 3.1 ports, and can be connected to more sensors
and devices.
The
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) also supports a wide temperature range of
-20°C to 60°C and fanless design without performance compromising, meeting the
harsh operating environment for factory automation and smart city applications.
The system also includes onboard memory with vibration resistance to reduce the
impact caused by movement.
DFI(http://www.dfi.com/?ad=media_1129-prnewswire_global&edm=media_1129-prnewswir
e_global) utilized the advantages of our advanced R&D design, continuing to
optimize applications for developing a dedicated embedded system. The
EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global
&edm=media_1129-prnewswire_global) will help to accelerate the overall
production efficiency, improve accuracy and achieve a zero-error production
line, scaling up the performance of smart factories and intelligent warehouse
applications.
Key Features:
- Intel® 11th Generation Tiger Lake Core™ i7/i5/i3 processors
- 8GB onboard memory and 1 SO-DIMM DDR4
- Supports up to 4 LAN or 6 USB (by SKU)
- Triple displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz)
- Supports wide temperature operation: -20°C~60°C
- Support M.2 B key 3042/3052 5G-NR module
- Supports up to 15 years of product lifecycle
Focus Applications:
- Factory automation
- Mobile Robotics (AMR) / Automated Guided Vehicles (AGV)
- Machine Vision
- Medical Imaging
About DFI
Founded in 1981, DFI is among the top 3 IPC providers of high-performance
computing technology across multiple embedded industries. DFI's
industrial-grade solutions enable customers to optimize their equipment and
ensure high reliability, long-term life cycle, and 24/7 durability in various
markets, including Industrial Automation, Medical, Gaming, Transportation,
Energy, Mission-Critical, and Retail. Find out more at http://www.dfi.com/.
CONTACT: DFI MARCOM, dfimarcom@dfi.com, 886-2-2697-2986
Source: DFI Inc.
Image Attachments Links:
Link: http://asianetnews.net/view-attachment?attach-id=435335
本プレスリリースは発表元が入力した原稿をそのまま掲載しております。また、プレスリリースへのお問い合わせは発表元に直接お願いいたします。
このプレスリリースには、報道機関向けの情報があります。
プレス会員登録を行うと、広報担当者の連絡先や、イベント・記者会見の情報など、報道機関だけに公開する情報が閲覧できるようになります。