DFI Empowers Edge AI Deployment with EC70A-TGU Compact Fanless System

DFI Inc.

PR99067

 

TAIPEI, Dec. 1, 2022 /PRNewswire=KYODO JBN/ --

 

DFI(http://www.dfi.com/?ad=media_1129-prnewswire_global&edm=media_1129-prnewswir

e_global), the leading global provider of embedded solutions and Edge AI

computing technology across multiple industries, is releasing the new Edge AI

inference computer

EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global

&edm=media_1129-prnewswire_global).

 

EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global

&edm=media_1129-prnewswire_global) is powered by Intel® 11th Gen Tiger Lake

Core™ processors, with 8GB onboard memory in a compact platform. Equipped with

an all-new GPU in Iris® Xe embedded graphics,

EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global

&edm=media_1129-prnewswire_global) delivers disruptive GPU graphics performance

and enables faster processing of images and video streams. Users can leverage

the GPU to power cutting-edge AI solutions for various applications, including

Industrial Automation, AMR/AGV, Smart Transportation, Medical Imaging, etc.

 

Maintaining the small size of the previous generation fanless embedded system,

the

EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global

&edm=media_1129-prnewswire_global) is equipped with a compact fanless design,

measuring only 181.6mm x 57mm x 118.4mm, while providing significantly upgraded

performance. In addition,

EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global

&edm=media_1129-prnewswire_global) supports multiple I/Os, outperforming its

counterparts with up to 6 USB 3.1 ports, and can be connected to more sensors

and devices.

 

The

EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global

&edm=media_1129-prnewswire_global) also supports a wide temperature range of

-20°C to 60°C and fanless design without performance compromising, meeting the

harsh operating environment for factory automation and smart city applications.

The system also includes onboard memory with vibration resistance to reduce the

impact caused by movement.

 

DFI(http://www.dfi.com/?ad=media_1129-prnewswire_global&edm=media_1129-prnewswir

e_global) utilized the advantages of our advanced R&D design, continuing to

optimize applications for developing a dedicated embedded system. The

EC70A-TGU(https://www.dfi.com/product/index/1569?ad=media_1129-prnewswire_global

&edm=media_1129-prnewswire_global) will help to accelerate the overall

production efficiency, improve accuracy and achieve a zero-error production

line, scaling up the performance of smart factories and intelligent warehouse

applications.

 

Key Features:

- Intel® 11th Generation Tiger Lake Core™ i7/i5/i3 processors

- 8GB onboard memory and 1 SO-DIMM DDR4

- Supports up to 4 LAN or 6 USB (by SKU)

- Triple displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz)

- Supports wide temperature operation: -20°C~60°C

- Support M.2 B key 3042/3052 5G-NR module

- Supports up to 15 years of product lifecycle

 

Focus Applications:

- Factory automation

- Mobile Robotics (AMR) / Automated Guided Vehicles (AGV)

- Machine Vision

- Medical Imaging

 

About DFI

 

Founded in 1981, DFI is among the top 3 IPC providers of high-performance

computing technology across multiple embedded industries. DFI's

industrial-grade solutions enable customers to optimize their equipment and

ensure high reliability, long-term life cycle, and 24/7 durability in various

markets, including Industrial Automation, Medical, Gaming, Transportation,

Energy, Mission-Critical, and Retail. Find out more at http://www.dfi.com/.

 

CONTACT: DFI MARCOM, dfimarcom@dfi.com, 886-2-2697-2986

 

Source: DFI Inc.

 

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