PR99205

HAIFA, Israel, Dec. 21, 2022 /PRNewswire=KYODO JBN/ --

-- Partnership solidifies proteanTecs' commitment to supporting Japan's high

performance computing industry and the global 2.5D and 3D advanced packaging

ecosystem

proteanTecs, a global leader of deep data analytics for advanced electronics,

announced today that PEZY Computing has selected the company's 2.5D

interconnect monitoring solution for interface validation, quality assurance

and reliability monitoring. PEZY, a Japanese semiconductor manufacturer of

advanced supercomputer processors, will use proteanTecs' solution to monitor

the die-to-die (D2D) connectivity in their next-generation processors.

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High-performance computing (HPC) applications are a main driver pushing the

semiconductor industry to adopt chiplet architectures and advanced packaging in

order to scale in a "More than Moore" era. However, heterogeneous systems have

thousands of potential failure points and limited visibility, where the weakest

link causes a full system failure.

To address this emerging industry need, the proteanTecs high-resolution

interconnect monitoring solution supports visibility at every stage—from

characterization and qualification, assembly and test, to field deployment and

operation. Unlike traditional approaches—which rely on low-granularity,

pass-fail testing—this market-leading, patented solution delivers parametric

lane grading with 100-percent lane and pin coverage, at test and in

mission-mode.

"proteanTecs' solution enhances processors with unparalleled visibility," said

Kei Ishii, VP Processor Engineering at PEZY Computing. "Their deep data

expedites system bring-up, characterization and testing, but it also benefits

end customers who can leverage this technology in the field. In uptime-critical

HPC and supercomputing environments, this solution is a gamechanger, allowing

for performance monitoring and time-to-failure prediction."

"PEZY's revolutionary supercomputer processors are on the leading edge of high

performance computing and deliver world-class energy efficiency," said Keith

Morton, CRO at proteanTecs. "As a proven leader in the supercomputing industry,

we welcome PEZY to our customer list."

PEZY uses the Global Unichip Corporation (GUC) High Bandwidth Memory Gen 3

(HBM3) PHY, a silicon-proven solution that integrates the proteanTecs D2D

interconnect monitoring technology.

About PEZY Computing

PEZY Computing is a fabless semiconductor manufacturer of leading-edge

supercomputer chips. Using proprietary manycore processor technology, PEZY's

advanced processors empower supercomputing systems to achieve top computing

performance and to deliver world-class energy efficiency. Featured on the

prestigious TOP500 and GREEN500 lists, PEZY's revolutionary solutions enable

new applications that have positively impacted society, such as the world's

fastest and most accurate human genome analysis. Founded in 2010, the company

is headquartered in Tokyo, Japan. For more information, visit

www.pezy.co.jp/en/.  

About proteanTecs

proteanTecs is the leading provider of deep data analytics for advanced

electronics monitoring. Trusted by global leaders in the datacenter,

automotive, communications and mobile markets, the company provides system

health and performance monitoring, from production to the field. By applying

machine learning to novel data created by on-chip monitors, the company's deep

data analytics solutions deliver unparalleled visibility and actionable

insights—leading to new levels of quality and reliability. Founded in 2017 and

backed by world-leading investors, the company is headquartered in Israel and

has offices in the United States, India and Taiwan. For more information, visit

www.proteanTecs.com.  

SOURCE  proteanTecs

Contact: Elizabeth Brown, Media Relations, elizabeth@proteanTecs.com, +1

619-993-4648