PR99771

TAIPEI, March 15, 2023 /PRNewswire=KYODO JBN/ --

DFI, a global leader in embedded motherboards and industrial computers,

announced that they will be participating in Embedded World 2023 and joining

Qualcomm Technologies, Inc. to showcase the world's first SBC equipped with the

high-performance Qualcomm® QRB5165 processor. With high integration capability

and anti-vibration features, the product can be applied in fields such as

industrial automation and AMR. It is expected to increase the overall AI edge

computing efficiency and bring more capabilities to the industry.

For the first time during the three-day Embedded World 2023 exhibition, DFI

will integrate the QRB551 industrial-grade motherboard built with the Qualcomm®

Robotics RB5 platform with 5G connectivity and AMR requirements. The solution

will be applied to a smart factory environment while executing appearance

recognition, defect detection, and human body posture recognition, which are

commonly seen in industrial automation.

"We are happy to work with Qualcomm Technologies and benefit from their

robotics series platform with low power consumption and high performance,"

expressed DFI President Alexander Su. "The QRB551 3.5-inch SBC is expected to

deliver greatly enhanced AI computing capabilities, as well as high flexibility

and expansion capabilities required by AMR to provide different platform

choices for industrial applications."

Dev Singh, Vice President of Business Development and Head of Building,

Enterprise & Industrial Automation at Qualcomm Technologies, Inc. said,

"Qualcomm Technologies continues to support innovative robotics with 5G

networks and top-level edge AI. The Qualcomm's QRB5165 processor is designed to

support the development of new-generation robotics and drone applications with

high-performance computing, low power consumption, and AI functions. We look

forward to seeing DFI's QRB551industrial-grade motherboard continue to optimize

and improve factory production and management,and accelerate AI edge computing

in various fields."

With the wave of new infrastructure construction brought about by global

industrial automation and digital transformation, DFI will collaborate with its

partners to continue developing and integrating miniature edge computing

products. Together they will provide advanced embedded solutions for various

fields and applications, becoming the best partners for enterprise OT

intelligence and laying the foundation for the future.

Please visit: https://www.dfi.com/, LinkedIn

(https://www.linkedin.com/company/dfi-inc/) or contact us (

https://www.dfi.com/contact/sales?ad=media_ew23-exh-pr-qrb551-launch-sbc-qualcomm-rb5-amr_global&edm=media_ew23-exh-pr-qrb551-launch-sbc-qualcomm-rb5-amr_global

).

Contact

Eva Chen eva.chen@dfi.com

Iris Chou iris.chou@dfi.com

Qualcomm is a trademark or registered trademark of Qualcomm Incorporated.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies,

Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by

Qualcomm Incorporated.

SOURCE:DFI Inc.

Image Attachments Links:

   Link: http://asianetnews.net/view-attachment?attach-id=438958

   Caption: DFI exhibited the world’s first industrial grade 3.5” SBC motherboard QRB551

equipped with Qualcomm® QRB5165 for smart factory applications at Embedded

World 2023.