JCET Subsidiaries Receive the 2020 Supplier Excellence Award from Texas Instruments

JCET Group

PR88905

 

SHANGHAI, April 8, 2021 /PRNewswire=KYODO JBN/ --

 

JCET subsidiaries, Jiangyin Changdian Advanced Packaging Co., LTD. (JCAP) and

STATS ChipPAC Korea Co., LTD ("SCK") each received the 2020 Supplier Excellence

Award from Texas Instruments (TI) for their outstanding IC manufacturing and

technical services. The Supplier Excellence Award is the highest recognition

given by TI to its elite suppliers, and its qualifications are based on: cost

control capability, environmental and social responsibility, technological

innovations, rapid response capability, supply assurance capability and product

quality. In 2020, TI did business with over 12,000 suppliers and JCAP and SCK

received the Supplier Excellence Award for their outstanding partnerships.

 

As a key industry source for wafer-level products, JCAP has the world's leading

R&D and production capacity for advanced wafer-level packaging, including

high-density fan-out solution and 2.5D high-density wafer-level packaging. This

is the fifth time that JCAP has received the Supplier Excellence Award. Ms.

Cynthia Zheng, General Manager of JCAP, said, "JCAP has been providing

middle-end packaging, testing services and new technology development for TI

for many years and has been awarded the Supplier Excellence Award five times.

The award not only reflects the recognition from TI toward JCAP's technical and

service capabilities, but also inspires us to continue to innovate and provide

even better services to our customers!"

 

SCK's strategic focus includes the application markets of 5G communication,

computing, industrial and consumer electronics while also continuing to expand

and innovate in the popular application fields of automotive and information

communication. As JCET's operational center in Korea, SCK is focused on

development and production of the world's top-tier high-density packaging

solutions, providing customers with best-in-class technology for

system-in-package (SiP), wafer-level packaging and automotive-grade flip chip

packaging and testing technologies. TI is one of the most important strategic

partners for SCK.  Mr. WonGyou Kim, General Manager of SCK, said: "TI's

Supplier Excellence Award is an affirmation of the partnership we have

developed over the years and it also lays a solid foundation for strengthening

our future cooperation. SCK will use this momentum to help further strengthen

the ties between TI and SCK, as well as JCET group as a whole, bringing even

bigger success to our partnership!"

 

In recent years, JCET has continued to expand the integration of resources and

synergies among its global manufacturing bases with each of its subsidiaries

having significantly improved their chipset manufacturing and technical service

capabilities, while developing a successful business strategy based on scale

and internationalization. "With a global vision to drive innovation and

differentiations, JCET has accumulated rich technology and service

capabilities, and has become the most trusted partner for many of our customers

across the globe." said Mr. Li Zheng, Chief Executive Officer of JCET.  "As key

business units of JCET, JCAP and SCK's customer award proves that our JCET

business strategy of internationalization and professional development is

paying off. Our company is driven to work around 'customer focus' as a core

value, providing leading chipset manufacturing services, and creating the best

value for our global customers."

 

About JCET

 

JCET is a leading global provider of integrated circuit manufacturing and

technology services, offering a full range of turnkey solutions for chipset

manufacturing, ranking 3rd in the world and 1st in mainland China.

 

Founded in 1972, JCET employs over 23,000 people worldwide and has operations

in over 22 countries and regions. With more than 3,200 patents, six

manufacturing powerhouse in China, Korea and Singapore, and two R&D centers,

JCET is committed to working closely with global customers.

 

JCET's full range of turnkey services include semiconductor package integration

design and characterization, R&D, wafer probe, wafer bumping, package assembly,

final test and drop shipment to vendors around the world. JCET's products,

services and technologies are used for mainstream IC system applications

including network communications, high performance computing, automotive

electronics, mass storage, and other areas.

 

About JCAP

 

JCAP is one of the key subsidiaries of JCET Group Co., Ltd., specializing in

semiconductor mid-end packaging and testing technology and providing advanced

technology services for chipset manufacturing to customers worldwide.

 

About SCK

 

As a proud member of JCET Group Co., Ltd., SCK is one of the group's global

semiconductor packaging and test providers offering a full range of turnkey

services including design and characterization, wafer bump, probe, assembly,

final test and system level testing.

 

SOURCE  JCET Group

 

Image Attachments Links:

 

   Link: http://asianetnews.net/view-attachment?attach-id=388566

 

   Caption: 2020 TI SEA

 

 

本プレスリリースは発表元が入力した原稿をそのまま掲載しております。また、プレスリリースへのお問い合わせは発表元に直接お願いいたします。

このプレスリリースには、報道機関向けの情報があります。

プレス会員登録を行うと、広報担当者の連絡先や、イベント・記者会見の情報など、報道機関だけに公開する情報が閲覧できるようになります。

プレスリリース受信に関するご案内

SNSでも最新のプレスリリース情報をいち早く配信中