JCET Subsidiaries Receive the 2020 Supplier Excellence Award from Texas Instruments
PR88905
SHANGHAI, April 8, 2021 /PRNewswire=KYODO JBN/ --
JCET subsidiaries, Jiangyin Changdian Advanced Packaging Co., LTD. (JCAP) and
STATS ChipPAC Korea Co., LTD ("SCK") each received the 2020 Supplier Excellence
Award from Texas Instruments (TI) for their outstanding IC manufacturing and
technical services. The Supplier Excellence Award is the highest recognition
given by TI to its elite suppliers, and its qualifications are based on: cost
control capability, environmental and social responsibility, technological
innovations, rapid response capability, supply assurance capability and product
quality. In 2020, TI did business with over 12,000 suppliers and JCAP and SCK
received the Supplier Excellence Award for their outstanding partnerships.
As a key industry source for wafer-level products, JCAP has the world's leading
R&D and production capacity for advanced wafer-level packaging, including
high-density fan-out solution and 2.5D high-density wafer-level packaging. This
is the fifth time that JCAP has received the Supplier Excellence Award. Ms.
Cynthia Zheng, General Manager of JCAP, said, "JCAP has been providing
middle-end packaging, testing services and new technology development for TI
for many years and has been awarded the Supplier Excellence Award five times.
The award not only reflects the recognition from TI toward JCAP's technical and
service capabilities, but also inspires us to continue to innovate and provide
even better services to our customers!"
SCK's strategic focus includes the application markets of 5G communication,
computing, industrial and consumer electronics while also continuing to expand
and innovate in the popular application fields of automotive and information
communication. As JCET's operational center in Korea, SCK is focused on
development and production of the world's top-tier high-density packaging
solutions, providing customers with best-in-class technology for
system-in-package (SiP), wafer-level packaging and automotive-grade flip chip
packaging and testing technologies. TI is one of the most important strategic
partners for SCK. Mr. WonGyou Kim, General Manager of SCK, said: "TI's
Supplier Excellence Award is an affirmation of the partnership we have
developed over the years and it also lays a solid foundation for strengthening
our future cooperation. SCK will use this momentum to help further strengthen
the ties between TI and SCK, as well as JCET group as a whole, bringing even
bigger success to our partnership!"
In recent years, JCET has continued to expand the integration of resources and
synergies among its global manufacturing bases with each of its subsidiaries
having significantly improved their chipset manufacturing and technical service
capabilities, while developing a successful business strategy based on scale
and internationalization. "With a global vision to drive innovation and
differentiations, JCET has accumulated rich technology and service
capabilities, and has become the most trusted partner for many of our customers
across the globe." said Mr. Li Zheng, Chief Executive Officer of JCET. "As key
business units of JCET, JCAP and SCK's customer award proves that our JCET
business strategy of internationalization and professional development is
paying off. Our company is driven to work around 'customer focus' as a core
value, providing leading chipset manufacturing services, and creating the best
value for our global customers."
About JCET
JCET is a leading global provider of integrated circuit manufacturing and
technology services, offering a full range of turnkey solutions for chipset
manufacturing, ranking 3rd in the world and 1st in mainland China.
Founded in 1972, JCET employs over 23,000 people worldwide and has operations
in over 22 countries and regions. With more than 3,200 patents, six
manufacturing powerhouse in China, Korea and Singapore, and two R&D centers,
JCET is committed to working closely with global customers.
JCET's full range of turnkey services include semiconductor package integration
design and characterization, R&D, wafer probe, wafer bumping, package assembly,
final test and drop shipment to vendors around the world. JCET's products,
services and technologies are used for mainstream IC system applications
including network communications, high performance computing, automotive
electronics, mass storage, and other areas.
About JCAP
JCAP is one of the key subsidiaries of JCET Group Co., Ltd., specializing in
semiconductor mid-end packaging and testing technology and providing advanced
technology services for chipset manufacturing to customers worldwide.
About SCK
As a proud member of JCET Group Co., Ltd., SCK is one of the group's global
semiconductor packaging and test providers offering a full range of turnkey
services including design and characterization, wafer bump, probe, assembly,
final test and system level testing.
SOURCE JCET Group
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Caption: 2020 TI SEA
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