PR98830

MUNICH, Nov. 16, 2022 /PRNewswire=KYODO JBN/-

ERS electronic (https://www.ers-gmbh.com/ ), the industry leader in thermal

management solutions for semiconductor manufacturing, upgrades its Warpage

Adjustment Tool

(https://www.ers-gmbh.com/fan-out-equipment/warpage-adjustment/wat ) (WAT330),

to include powerful capabilities for warpage measurement and correction.

WAT330: “ERS electronic’s Next-Generation Warpage Adjustment Tool is available

to order now.”

WAT330: “ERS electronic’s Next-Generation Warpage Adjustment Tool is available

to order now.”

Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced

Packaging technologies. However, wafer deformity, also called "warpage" remains

a common issue. As the technology continues to be adopted by OSATs and has

transitioned from research to high-volume manufacturing, understanding and

handling warpage is crucial to avoid machine downtime and low yield.

"For FoWLP, one of the major challenges is warpage within the process flow. In

our models and tests we observed significant impact from material behavior,

layout, geometry and loading history," says Dr. Olaf Wittler, head of the team

Technology Characterization & Reliability Simulation at Fraunhofer IZM.

"Therefore, solutions and strategies to control these influence factors for a

low warpage are crucial to solve the challenge."

ERS has almost 15 years of experience in adjusting warpage of molded wafers in

Fan-out. The company is recognized industry-wide for its patented AirCushion

technology and TriTemp slide for contactless transport and warpage output of <1

mm. They can both be found in most of ERS's machines and are typically applied

for warpage correction after thermal debonding. However, with the WAT330,

companies can address the issue of warpage regardless of where it occurs.

"Warpage is a top concern in high volume production and will remain so as the

structure of FO becomes more complex," says Debbie-Claire Sanchez, FO Equipment

Business Unit manager at ERS electronic. "We therefore extend our warpage

correction capabilities to a standalone machine, which can be deployed

in-between processes to aid manufacturing."

The upgraded WAT330 comes with a HEPA filter system for cleanroom class 100. It

is also fully compliant with the GEM300 SEMI standards and compatible with

automated product loading and unloading. Another noteworthy upgrade is the

machine's Nitrogen environment, which can reach down to 0.5% O2 level to avoid

Cu oxidation. The new WAT330 also features strong vacuum thermal chucks for

no-fail wafer handling.

The machine is available to order now.

About ERS:

ERS electronic GmbH has gained an outstanding reputation in the semiconductor

industry with its fast and accurate air cool-based thermal chuck systems for

wafer probing and its thermal debonding and warpage adjustment tools for

FOWLP/PLP.

www.ers-gmbh.com

Photo: https://mma.prnewswire.com/media/1948332/WAT330_machine.jpg

Logo: https://mma.prnewswire.com/media/1801970/ERS_electronic_GmbH_Logo.jpg

Source: ERS electronic GmbH