PR95536

SHANGHAI, April 19, 2022 /PRNewswire=KYODO JBN/ --

JCET Advanced Packaging Co., Ltd.(JCAP), a subsidiary of JCET Group, has

received the Texas Instruments (TI) 2021 Supplier Excellence Award. This is the

sixth time that JCAP has won this award for its excellence in integrated

circuit product manufacturing and technical service capabilities. The "TI

Supplier Excellence Award" is the highest TI award issued to their best

performing global suppliers.

JCAP is an important part of JCET's six global production bases and has the

world's leading R&D and production capabilities for wafer-level advanced

packaging technology. Texas Instruments (TI) is a global semiconductor design

and manufacturing company focused on the development of analog integrated

circuits (ICs) and embedded processors.

The "2021 TI Supplier Excellence Award" is a recognition of JCAP's high-quality

products, services and technical support, environmental and social

responsibility, technology, responsiveness, and on-time delivery. This

recognition of comprehensive excellent performance is also a reaffirmation of

the relationship between Texas Instruments (TI) and JCAP since 2007.

In 2022, JCET will continue to maintain the momentum of steady growth, relying

on advanced chip manufacturing technology to enhance customer value. Mr. Li

Zheng, Chief Executive Officer of JCET, said, "JCET is committed to developing

and providing cutting-edge chipset backend manufacturing services in scale,

including wafer-level advanced packaging solutions. Our professional

manufacturing and technical services in high-density bumping, WLCSP, fan-out

packaging, and chiplet solutions have been recognized by domestic and

international customers. TI is a leading company in the global semiconductor

industry, and we value our long-term and stable relationship and appreciate

TI's recognition of JCAP. Together with our customers, we will continue to grow

our contributions to the sustainable development of the global semiconductor

industry."

About JCET:

JCET Group is the world's leading integrated-circuit manufacturing and

technology services provider, offering a full range of turnkey services that

include semiconductor package integration design and characterization, R&D,

wafer probe, wafer bumping, package assembly, final test and drop shipment to

vendors around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor

applications such as mobile, communication, compute, consumer, automotive and

industry etc., through advanced wafer level packaging, 2.5D/3D,

System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET

Group has two R&D centers in China and Korea, six manufacturing locations in

China, Korea and Singapore, and sales centers around the world, providing close

technology collaboration and efficient supply-chain manufacturing to customers

in China and around the world.

SOURCE: JCET Group

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